WEST LAFAYETTE, Ind. – Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to ...

A new study is providing new insights into how next-generation electronics, including memory components in computers, breakdown or degrade over time. A new study led by researchers at the University ...

As technology continues to evolve at a rapid pace, the field of microelectronics is becoming increasingly vital to many industries. A degree in microelectronic engineering offers graduates a diverse ...

The funding is part of a larger $32.7 million award to 14 colleges meant to improve the performance of emerging commercial and defense systems The University of Colorado Boulder is receiving $1.5 ...

Unfortunately, this book can't be printed from the OpenBook. If you need to print pages from this book, we recommend downloading it as a PDF. Visit NAP.edu/10766 to get more information about this ...

The Department of the Air Force reviewed the Microelectronics Quantifiable Assurance efforts by the Office of the Under Secretary of Defense for Research and Engineering, as directed by the National ...

Triboelectric and piezoelectric energy harvesters can hardly power most microelectronic systems. Rotational electromagnetic harvesters are very promising alternatives, but their performance is highly ...

The thermal management of semiconductors at the device level has become a crucial issue owing to the high integration density and miniaturization of microelectronic systems. Because surface phonon ...

Phoenix Semiconductor has won a Phase II SBIR contract from the U.S. Defense Logistics ...

A new technical paper titled “Recent Progress in Structural Integrity Evaluation of Microelectronic Packaging Using Scanning Acoustic Microscopy (SAM): A Review” was published by researchers at ...